3D embedded freeform electrical circuitry in metal componentry

Conference paper


Nguyen, TT, Li, J and Harris, RA (2016). 3D embedded freeform electrical circuitry in metal componentry. Solid Freeform Fabrication (SFF) Conference. Texas, United States 01 Aug 2016
AuthorsNguyen, TT, Li, J and Harris, RA
TypeConference paper
Abstract

A novel embedding process combining the use an ultrasonic solid-state welding technique coupled with a material direct writing technique to embed electronic devices and to print conductive features inside a three dimensional metallic housing container is proposed. This process has the advantages of (i) inexpensive fabrication, (ii) flexibility in sizes of embedded devices, and (iii) allowing for arrangement of embedded components in 3D. A fully functional demonstrator of a complete 3D LED circuitry has been successfully fabricated as the results of our
fundamental researches gathered.

KeywordsUltrasonic solid state welding; Material direct writing; Additive manufacturing; 3D; Conductivity; Surface roughness
Year2016
Accepted author manuscript
License
File Access Level
Open
Publication dates
Print01 Aug 2016
Publication process dates
Deposited30 Jan 2018
Accepted01 Jun 2016
Permalink -

https://openresearch.lsbu.ac.uk/item/872z7

Download files


Accepted author manuscript
ttn_2016_poster_3Dembedelectronics.pdf
License: CC BY 4.0
File access level: Open

  • 81
    total views
  • 37
    total downloads
  • 1
    views this month
  • 1
    downloads this month

Export as

Related outputs

Estimation of damage location in advanced composite materials
Nguyen, TT (2010). Estimation of damage location in advanced composite materials. Engineering Conference. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK 2010 Loughborough University.
Fast Fourier Virtual Fields Method for determination of modulus distributions from full-field optical strain data
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2013). Fast Fourier Virtual Fields Method for determination of modulus distributions from full-field optical strain data. in: Osten, W (ed.) Fringe 2013 Berlin Springer. pp. 161-166
A Fourier-series-based virtual fields method for the identification of 2-D stiffness distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2014). A Fourier-series-based virtual fields method for the identification of 2-D stiffness distributions. International Journal for Numerical Methods in Engineering. 98 (12), pp. 917-936. https://doi.org/10.1002/nme.4665
A Fourier-series-based Virtual Fields Method for the Identification of 2-D Stiffness and Traction Distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2014). A Fourier-series-based Virtual Fields Method for the Identification of 2-D Stiffness and Traction Distributions. Strain. 50 (5), pp. 454-468. https://doi.org/10.1111/str.12105
Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing
Li, J, Monaghan, T, Nguyen, TT, Kay, RW, Friel, RJ and Harris, RA (2017). Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing. Composites Part B: Engineering. 113, pp. 342-354. https://doi.org/10.1016/j.compositesb.2017.01.013
A Fourier-series-based virtual fields method for the identification of three-dimensional stiffness distributions and its application to incompressible materials
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2017). A Fourier-series-based virtual fields method for the identification of three-dimensional stiffness distributions and its application to incompressible materials. Strain. 53 (5), pp. e12229-e12229. https://doi.org/10.1111/str.12229
Challenges in designing a localisation system suitable for hazardous environments
Nguyen, TT, Kaur, A and Howlader, MOF (2017). Challenges in designing a localisation system suitable for hazardous environments. Michal Lyons Poster Competition. London South Bank University, London 01 Jul 2017
Hybrid additive manufacturing of 3D electronic systems
Li, J, Wasley, T, Nguyen, TT, Ta, VD, Shephard, JD, Stringer, J, Smith, P, Esenturk, E, Connaughton, C and Kay, R (2016). Hybrid additive manufacturing of 3D electronic systems. Journal of Micromechanics and Microengineering. 26 (10), pp. 105005-105005. https://doi.org/10.1088/0960-1317/26/10/105005
Fourier-series-based Virtual Fields Method for the identification of 3-D stiffness distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2014). Fourier-series-based Virtual Fields Method for the identification of 3-D stiffness distributions. 16th International Conference on Experimental Mechanics (ICEM16). Cambridge 07 - 11 Jul 2014 European Association for Experimental Mechanics.
A Fourier-series-based Virtual Fields Method for the identification of modulus distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2013). A Fourier-series-based Virtual Fields Method for the identification of modulus distributions. BSSM Seminar on Tomographic Imaging of Displacement and Strain Fields. Loughborough University, Loughborough, UK 10 Apr 2013 The British Society for Strain Measurement (BSSM).
Fourier-series-based Virtual Fields Method for the identification of 2-D stiffness distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2013). Fourier-series-based Virtual Fields Method for the identification of 2-D stiffness distributions. International conference on full-field measurement techniques and their applications in experimental solid mechanics (PhotoMechanics 2013). Montpellier 27 - 29 May 2013 Institut Clément Ader (ICA).
Monocular three-dimensional self-calibrating surface reconstruction using digital photogrammetry
Nguyen, TT, Suada, MG, Dirgantara, G and Putra, IS (2008). Monocular three-dimensional self-calibrating surface reconstruction using digital photogrammetry. AUN/SEED-Net Regional Workshop on Mechanical and Aerospace Engineering. Bandung, Indonesia 23 - 24 Jul 2008 AUN/SEED-Net.
Three-dimensional self-calibrating surface reconstruction using digital photogrammetry
Nguyen, TT (2008). Three-dimensional self-calibrating surface reconstruction using digital photogrammetry. AUN/SEED-Net Workshop on Mechanical and Aerospace Engineering. Bandung Institute of Technology, Bandung, Indonesia 23 - 24 Jul 2008 AUN/SEED-Net.
Three-dimensional surface reconstruction of aircraft component using digital photogrammetry
Nguyen, TT, Suada, MG, Dirgantara, T and Putra, IS (2007). Three-dimensional surface reconstruction of aircraft component using digital photogrammetry. 2nd Regional Conference on Aerospace Science, Technology and Industry. Bandung, Indonesia 01 - 02 Jul 2007 Department of Aeronautics and Astronautics.