3D embedded freeform electrical circuitry in metal componentry
Conference paper
Nguyen, TT, Li, J and Harris, RA (2016). 3D embedded freeform electrical circuitry in metal componentry. Solid Freeform Fabrication (SFF) Conference. Texas, United States 01 Aug 2016
Authors | Nguyen, TT, Li, J and Harris, RA |
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Type | Conference paper |
Abstract | A novel embedding process combining the use an ultrasonic solid-state welding technique coupled with a material direct writing technique to embed electronic devices and to print conductive features inside a three dimensional metallic housing container is proposed. This process has the advantages of (i) inexpensive fabrication, (ii) flexibility in sizes of embedded devices, and (iii) allowing for arrangement of embedded components in 3D. A fully functional demonstrator of a complete 3D LED circuitry has been successfully fabricated as the results of our |
Keywords | Ultrasonic solid state welding; Material direct writing; Additive manufacturing; 3D; Conductivity; Surface roughness |
Year | 2016 |
Accepted author manuscript | License File Access Level Open |
Publication dates | |
01 Aug 2016 | |
Publication process dates | |
Deposited | 30 Jan 2018 |
Accepted | 01 Jun 2016 |
Permalink -
https://openresearch.lsbu.ac.uk/item/872z7
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Accepted author manuscript
ttn_2016_poster_3Dembedelectronics.pdf | ||
License: CC BY 4.0 | ||
File access level: Open |
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