3D embedded freeform electrical circuitry in metal componentry

Conference item


Nguyen, TT, Li, J and Harris, RA (2016). 3D embedded freeform electrical circuitry in metal componentry. Solid Freeform Fabrication (SFF) Conference. Texas, United States 01 Aug 2016 London South Bank University.
AuthorsNguyen, TT, Li, J and Harris, RA
Abstract

A novel embedding process combining the use an ultrasonic solid-state welding technique coupled with a material direct writing technique to embed electronic devices and to print conductive features inside a three dimensional metallic housing container is proposed. This process has the advantages of (i) inexpensive fabrication, (ii) flexibility in sizes of embedded devices, and (iii) allowing for arrangement of embedded components in 3D. A fully functional demonstrator of a complete 3D LED circuitry has been successfully fabricated as the results of our
fundamental researches gathered.

KeywordsUltrasonic solid state welding; Material direct writing; Additive manufacturing; 3D; Conductivity; Surface roughness
Year2016
PublisherLondon South Bank University
Accepted author manuscript
License
CC BY 4.0
Publication dates
Print01 Aug 2016
Publication process dates
Deposited30 Jan 2018
Accepted01 Jun 2016
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https://openresearch.lsbu.ac.uk/item/872z7

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