Hybrid additive manufacturing of 3D electronic systems

Journal article


Li, J, Wasley, T, Nguyen, TT, Ta, VD, Shephard, JD, Stringer, J, Smith, P, Esenturk, E, Connaughton, C and Kay, R (2016). Hybrid additive manufacturing of 3D electronic systems. Journal of Micromechanics and Microengineering. 26 (10), pp. 105005-105005. https://doi.org/10.1088/0960-1317/26/10/105005
AuthorsLi, J, Wasley, T, Nguyen, TT, Ta, VD, Shephard, JD, Stringer, J, Smith, P, Esenturk, E, Connaughton, C and Kay, R
Abstract

This is an author-created, un-copyedited version of an article accepted for publication/published
in Journal of Micromechanics and Microengineering. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or
any version derived from it. The Version of Record is available online at 10.1088/0960-1317/26/10/105005

A novel hybrid additive manufacturing (AM) technology combining digital light projection (DLP) stereolithography (SL) with 3D micro-dispensing alongside conventional surface mount packaging is presented in this work. This technology overcomes the inherent limitations of individual AM processes and integrates seamlessly with conventional packaging processes to enable the deposition of multiple materials. This facilitates the creation of bespoke end-use products with complex 3D geometry and multi-layer embedded electronic systems. Through a combination of four-point probe measurement and non-contact focus variation microscopy, it was identified that there was no obvious adverse effect of DLP SL embedding process on the electrical conductivity of printed conductors. The resistivity maintained to be less than 4  ×  10−4 Ω centerdot cm before and after DLP SL embedding when cured at 100 °C for 1 h. The mechanical strength of SL specimens with thick polymerized layers was also identified through tensile testing. It was found that the polymerization thickness should be minimised (less than 2 mm) to maximise the bonding strength. As a demonstrator a polymer pyramid with embedded triple-layer 555 LED blinking circuitry was successfully fabricated to prove the technical viability.

Year2016
JournalJournal of Micromechanics and Microengineering
Journal citation26 (10), pp. 105005-105005
PublisherIOP Publishing
ISSN0960-1317
Digital Object Identifier (DOI)https://doi.org/10.1088/0960-1317/26/10/105005
Publication dates
Print23 Aug 2016
Publication process dates
Deposited12 Dec 2017
Accepted28 Jun 2016
Accepted author manuscript
License
File Access Level
Open
Permalink -

https://openresearch.lsbu.ac.uk/item/872qq

Download files


Accepted author manuscript
ttn_microeng_3dp.pdf
License: CC BY 4.0
File access level: Open

  • 143
    total views
  • 282
    total downloads
  • 1
    views this month
  • 1
    downloads this month

Export as

Related outputs

Fast Fourier Virtual Fields Method for determination of modulus distributions from full-field optical strain data
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2013). Fast Fourier Virtual Fields Method for determination of modulus distributions from full-field optical strain data. in: Osten, W (ed.) Fringe 2013 Berlin Springer. pp. 161-166
A Fourier-series-based virtual fields method for the identification of 2-D stiffness distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2014). A Fourier-series-based virtual fields method for the identification of 2-D stiffness distributions. International Journal for Numerical Methods in Engineering. 98 (12), pp. 917-936. https://doi.org/10.1002/nme.4665
A Fourier-series-based Virtual Fields Method for the Identification of 2-D Stiffness and Traction Distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2014). A Fourier-series-based Virtual Fields Method for the Identification of 2-D Stiffness and Traction Distributions. Strain. 50 (5), pp. 454-468. https://doi.org/10.1111/str.12105
Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing
Li, J, Monaghan, T, Nguyen, TT, Kay, RW, Friel, RJ and Harris, RA (2017). Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing. Composites Part B: Engineering. 113, pp. 342-354. https://doi.org/10.1016/j.compositesb.2017.01.013
A Fourier-series-based virtual fields method for the identification of three-dimensional stiffness distributions and its application to incompressible materials
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2017). A Fourier-series-based virtual fields method for the identification of three-dimensional stiffness distributions and its application to incompressible materials. Strain. 53 (5), pp. e12229-e12229. https://doi.org/10.1111/str.12229
Challenges in designing a localisation system suitable for hazardous environments
Nguyen, TT, Kaur, A and Howlader, MOF (2017). Challenges in designing a localisation system suitable for hazardous environments. Michal Lyons Poster Competition. London South Bank University, London 01 Jul 2017
3D embedded freeform electrical circuitry in metal componentry
Nguyen, TT, Li, J and Harris, RA (2016). 3D embedded freeform electrical circuitry in metal componentry. Solid Freeform Fabrication (SFF) Conference. Texas, United States 01 Aug 2016
Fourier-series-based Virtual Fields Method for the identification of 3-D stiffness distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2014). Fourier-series-based Virtual Fields Method for the identification of 3-D stiffness distributions. 16th International Conference on Experimental Mechanics (ICEM16). Cambridge 07 - 11 Jul 2014 European Association for Experimental Mechanics.
A Fourier-series-based Virtual Fields Method for the identification of modulus distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2013). A Fourier-series-based Virtual Fields Method for the identification of modulus distributions. BSSM Seminar on Tomographic Imaging of Displacement and Strain Fields. Loughborough University, Loughborough, UK 10 Apr 2013 The British Society for Strain Measurement (BSSM).
Fourier-series-based Virtual Fields Method for the identification of 2-D stiffness distributions
Nguyen, TT, Huntley, JM, Ashcroft, IA, Ruiz, PD and Pierron, F (2013). Fourier-series-based Virtual Fields Method for the identification of 2-D stiffness distributions. International conference on full-field measurement techniques and their applications in experimental solid mechanics (PhotoMechanics 2013). Montpellier 27 - 29 May 2013 Institut Clément Ader (ICA).
Estimation of damage location in advanced composite materials
Nguyen, TT (2010). Estimation of damage location in advanced composite materials. Engineering Conference. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK 2010 Loughborough University.
Monocular three-dimensional self-calibrating surface reconstruction using digital photogrammetry
Nguyen, TT, Suada, MG, Dirgantara, G and Putra, IS (2008). Monocular three-dimensional self-calibrating surface reconstruction using digital photogrammetry. AUN/SEED-Net Regional Workshop on Mechanical and Aerospace Engineering. Bandung, Indonesia 23 - 24 Jul 2008 AUN/SEED-Net.
Three-dimensional self-calibrating surface reconstruction using digital photogrammetry
Nguyen, TT (2008). Three-dimensional self-calibrating surface reconstruction using digital photogrammetry. AUN/SEED-Net Workshop on Mechanical and Aerospace Engineering. Bandung Institute of Technology, Bandung, Indonesia 23 - 24 Jul 2008 AUN/SEED-Net.
Three-dimensional surface reconstruction of aircraft component using digital photogrammetry
Nguyen, TT, Suada, MG, Dirgantara, T and Putra, IS (2007). Three-dimensional surface reconstruction of aircraft component using digital photogrammetry. 2nd Regional Conference on Aerospace Science, Technology and Industry. Bandung, Indonesia 01 - 02 Jul 2007 Department of Aeronautics and Astronautics.